Any

Aluminum electrolytic "can" style capacitors, Pitch x Diameter x Height: 2x5.5x12mm, 2.5x6.8x12.2mm, and 3.5x8.5x12.5mm in vertical and bent-lead styles. Bent-lead styles have bends in either direction.

JEDEC

JEDEC Small Outline Package (SO, SOP, SOIC), various profiles per JEDEC standards MS-012, MS-013, MO-271, and MO-046. Configurations use IPC-7351 standard naming conventions and maximum tolerance dimensions except for lead cross-sections. Thermal pads, for the configurations that have them, are minimum tolerance since only min is specified in the JEDEC standards.

Any

1-50 position Male 0.100" pin header. 0.235" top lead length, 0.145" bottom lead length. 0.100" pitch

Any

Surface mount resistor, multiple packages (configurations); IPC standard naming convention in most material condition

Any

Surface mount ceramic capacitor, multiple sizes, IPC standard naming convention in most material condition

National Semiconductor / TI

TO-PMOD-11 power module package from Texas Instruments. Used by the LMZ series of high-power buck switchers.

Any

SOIC-14 SMD package

Any

SMD diode

Any

SMD diode

Any

SOIC-16 SMD package