Paolo Baesso

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Description
Ultra Thin Dual Flat No Leads package, 8 leads + exposed thermal pad. Based on dimensions in datasheet for KTD2037 and similar ICs.
Tags
Contributed by
Company
University of Bristol
Configurations?
No
Downloads
70
Added on
3 Jul, 2022
Name
Description
BGA20, 1.6mm x 2.0mm
Contributed by
Company
University of Bristol
Configurations?
No
Downloads
189
Added on
22 Jun, 2022
Part Number
Supplier
NXP
Description
None Provided
Category
Contributed by
Company
University of Bristol
Configurations?
No
Downloads
84
Added on
10 Feb, 2022
Description
None Provided
Category
Contributed by
Company
University of Bristol
Configurations?
No
Downloads
140
Added on
10 Feb, 2022
Name
Part Number
Supplier
ST
Description
QFN 6L package. 1.7 mm x 1.5 mm x 0.5 mm typical.
Tags
Contributed by
Company
University of Bristol
Configurations?
No
Downloads
234
Added on
25 May, 2021