QUECTEL

L86 is an ultra-compact GNSS POT (Patch on Top) module with an embedded 18.4mm × 18.4mm × 4.0mm patch antenna and utilizes the MediaTek new generation GNSS chipset MT3333 that achieves the perfect performance. Designed to be compatible with Quectel GPS L80 module in the compact and unified form factor, it provides a flexible and scalable platform for migrating from GPS to GNSS. This space-saving design makes L86 a perfect module for miniature devices. Adopting LCC package and integrating patch antenna, L86 has exceptional performance both in acquisition and tracking.

ANALOG DEVICES

8-Lead Lead Frame Chip Scale Package 2 mm × 2 mm Body, Ultra Thin, Dual Lead (CP-8-10)

TDK Invensense

World’s Lowest Power 9-Axis MEMS MotionTracking™ Device. 24 Lead QFN 3.0x3.0x0.9.

ST

UFQFPN28 is a 28-lead, 4x4 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package.

ST

LCC8 — 8-pin, 1.5 x 3.2 mm leadless chip carrier package outline.

Ohmite

Ohmite’s MacroChip resistors bring precision high voltage capabilities to surface mount applications. Designed with thick film on alumina substrate technology, the resistors can be pro-vided in precision tolerances, high volt-age ratings, and high resistance values. The planar package design is low profile for easy use with instrumentation, medi-cal equipment, voltage regulators, and power supplies.

Vishay

SOT-23 generic package

NXP

SOD323F plastic, surface-mounted package; 2 leads; 1.7 mm x 1.25 mm x 0.7 mm body

Linear Technology

S5 Package 5-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1635)

TDK (EPCOS)

QCS5P package (SAW RF filters)