Silicone Free Thermal Gap Filler

Supplier:
Laird Technologies
Model Name:
Silicone Free Thermal Gap Filler
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Part Number:
TIM_Silicone_Free
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Modified on: July 07,2021  
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Specifications
Supplier part number: TIM_Silicone_Free
Name:Silicone Free Thermal Gap Filler
Description:

Laird gap filler pads are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance. 

Laird’s silicone gap filler product lines includes:

  • Products ranging from 1-34 W/mk Thermal conductivity
  • Tflex SF600
  • Tflex SF800
  • Tflex SF10
  • Tflex HP34

Industries:

  • Consumer Electronics
  • Automotive
  • Telecom
  • Data Infrastructure
  • Industrial 
  • Aerospace & Defense

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Laird Technologies
Laird enables and protects the sensitive electronic components that power the world’s most sophisticated devices and machines. We partner with leading technology brands to deliver custom-engineered thermal interface materials, microwave absorbers, precision metals, EMC components, and EMI suppression solutions. Our product portfolio enhances the performance and reliability of electronics, including wearable devices, personal computers, servers, MRI machines, automobiles, 5G base stations, smart meters and much more.
Laird Technologies
16401 Swingley Ridge Road
Suite 700
 Chesterfield, Missouri, 63017
United States
Phone: (866) 928-8181 or (636) 898-6000
Fax: (636) 898-6100
Email:
Web Page: http://www.laird.com
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