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Results 1071-1080 of 3147
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Part Number
Supplier
Pulse
Description
10/100/1000 Base-T Pulse Transformer. Pulse HX5008FNL. Used the manufacturers model, but coloured it and inserted logo and part number.
Contributed by
Company
Topcon Agriculture
Configurations?
No
Downloads
207
Added on
12 Jun, 2019
Name
Part Number
Supplier
Littelfuse
Description
SOT035P100X100-05
Tags
Contributed by
Company
Etteplan Finland Oz
Configurations?
No
Downloads
109
Added on
11 Jun, 2019
Part Number
Supplier
TriQuint
Description
General DescriptionThe TriQuint TGA2704-SM provides 21 dB of smallsignal gain and 8W of output power across 9-11GHz. TGA2704-SM is designed using TriQuint’sproven standard 0.25μm gate pHEMT 3MI productionprocess.The TGA2704-SM features a ceramic QFN designedfor surface mount to a printed circuit board.Fully matched to 50 ohms and with integrated DCblocking capacitors on both I/O ports, the TGA2704-SM is ideally suited to support both commercialand defense related applicationsLead-free and RoHS compliant.Applications- Marine and Air Radar, Traffic Control- Weather Monitoring- Port Security- Point-to-Point Radio- CommunicationsProduct Features- Frequency Range: 9 - 11 GHz- Saturated Output Power: 39 dBm- Small Signal Gain: 21 dB- Bias: Vd = 9 V, Idq = 1.05 A, Vg = -0.74 V typical
Contributed by
Company
Speed Design
Configurations?
No
Downloads
78
Added on
10 Jun, 2019
Part Number
Supplier
CREE
Description
CGHV96100F2100 W, 8.4 - 9.6 GHz, 50-ohm, Input/Output Matched GaN HEMTCree’s CGHV96100F2 is a gallium nitride (GaN) High Electron Mobility Transistor(HEMT) on Silicon Carbide (SiC) substrates. This GaN Internally Matched (IM) FEToffers excellent power added efficiency in comparison to other technologies. GaNhas superior properties compared to silicon or gallium arsenide, including higherbreakdown voltage, higher saturated electron drift velocity and higher thermalconductivity. GaN HEMTs also offer greater power density and wider bandwidthscompared to GaAs transistors. This IM FET is available in a metal/ceramic flangedpackage for optimal electrical and thermal performance.
Contributed by
Company
Speed Design
Configurations?
No
Downloads
130
Added on
9 Jun, 2019
Description
Power Splitter/Combiner3 Way-0° 50Ω 1 to 300 MHz
Contributed by
Company
Speed Design
Configurations?
No
Downloads
66
Added on
22 May, 2019
Description
None Provided
Contributed by
Company
SFU
Configurations?
Yes
Downloads
279
Added on
8 Jun, 2019
Description
None Provided
Contributed by
Company
SFU
Configurations?
Yes
Downloads
185
Added on
8 Jun, 2019
Description
None Provided
Contributed by
Company
SFU
Configurations?
Yes
Downloads
122
Added on
8 Jun, 2019
Name
Description
uQFN package, MAX dimensions: 2.25(L) x 1.4(W) x 0.5(H), 10 pins.
Contributed by
Company
Topcon Agriculture
Configurations?
No
Downloads
184
Added on
3 Jun, 2019
Name
Description
Diode Body MicroSMA used by Taiwan Semiconductor
Tags
Contributed by
Company
exelonx
Configurations?
No
Downloads
64
Added on
1 Jun, 2019