Laird gap filler pads are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance. 

Laird’s extensive gap filler product lines includes:

• Products ranging from 1-34 W/mk Thermal conductivity
• Thickness ranges from 0.25mm to 5mm
• High Deflection Series (Tflex HD300, Tflex HD700, Tflex HD8000, and Tflex HD90000)

Industries:

• Consumer Electronics
• Automotive
• Telecom
• Data Infrastructure
• Industrial 
• Aerospace & Defense

Website Link: Product Catalog Page

By pairing our standard gap filler products with added electrically insulating materials we are able to offer products that provide thermal performance and dielectric strength. These materials also have smoother surfaces and better cut-through resistance.  

Laird’s electrically insulating gap filler product lines includes:

• Tflex 300TG
• Tflex P100
• Tflex HD300TG
• Tflex P300

Industries:

• Consumer Electronics
• Automotive
• Telecom
• Data Infrastructure
• Industrial 
• Aerospace & Defense

Website Link: Product Catalog Page

Laird gap filler pads are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance. 

Laird’s silicone gap filler product lines includes:

• Products ranging from 1-34 W/mk Thermal conductivity
• Tflex SF600
• Tflex SF800
• Tflex SF10
• Tflex HP34

Industries:

• Consumer Electronics
• Automotive
• Telecom
• Data Infrastructure
• Industrial 
• Aerospace & Defense

Website Link: Product Catalog Page